Product Detail

MDM9607 FIRMWARE

https://www.qualcomm.com/snapdragon

Vendor :

Qualcomm

Number of CVE:

736

Average Exploit Prediction Score :

0.25

Public Exploit/PoC Code :

39

CISA Actively Exploited :

2

Last Vulnerability Seen :

Nov. 26, 2024
Vulnerabilities

The following vulnerabilities are recorded MDM9607 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 May 24, 2019 CVE-2018-13895 HIGH
7.8
2 May 24, 2019 CVE-2018-13887 HIGH
10.0
3 May 24, 2019 CVE-2018-13886 HIGH
10.0
4 May 24, 2019 CVE-2018-13885 MEDIUM
5.5
5 May 24, 2019 CVE-2018-12013 HIGH
7.8
6 May 24, 2019 CVE-2018-12012 HIGH
7.8
7 May 24, 2019 CVE-2018-12005 MEDIUM
5.5
8 May 24, 2019 CVE-2018-12004 MEDIUM
5.5
9 May 24, 2019 CVE-2018-11976 MEDIUM
5.5
10 May 24, 2019 CVE-2018-11968 HIGH
7.8
11 May 24, 2019 CVE-2018-11967 HIGH
7.8
12 May 24, 2019 CVE-2018-11953 HIGH
10.0
13 May 24, 2019 CVE-2018-11949 HIGH
10.0
14 May 24, 2019 CVE-2018-11940 HIGH
10.0
15 May 24, 2019 CVE-2018-11937 HIGH
10.0
16 May 24, 2019 CVE-2018-11936 HIGH
10.0
17 May 24, 2019 CVE-2018-11930 HIGH
10.0
18 May 24, 2019 CVE-2018-11928 HIGH
7.8
19 May 24, 2019 CVE-2018-11927 HIGH
7.8
20 May 24, 2019 CVE-2018-11925 HIGH
7.8
SEVERITY DISTRIBUTION CHART