Vendor
H
Hardware
QUALCOMM
has published 21494 vulnerabilities in 2024.
14 have exploits , 0 scored > 90% EPSS and 3 in CISA KEV .
Total Vulnerabilities Breakdown
20291
CRITICAL
155051
HIGH
19249
MEDIUM
194591
Total CVE Number
Vulnerability Stream by Days
Products Security Index
The following products are associated with the
QUALCOMM vendor. You can explore the
security posture of each product by clicking on the product name.
| Product Name | Number of CVE | Latest CVE Release Date | Actions |
|---|---|---|---|
| Snapdragon 430 | 2 | Jul 04, 2023 | |
| Snapdragon x70 | 2 | Jul 04, 2023 | |
| Snapdragon 435 | 1 | Jul 04, 2023 | |
| Snapdragon 427 | 1 | Jul 04, 2023 | |
| Snapdragon 865 | 1 | Jul 04, 2023 | |
| Snapdragon 778g | 1 | Jul 04, 2023 | |
| Snapdragon 780g | 1 | Jul 04, 2023 | |
| Snapdragon 865 | 1 | Jul 04, 2023 | |
| Snapdragon 870 | 1 | Jul 04, 2023 | |
| Snapdragon 888 | 1 | Jul 04, 2023 | |
| Snapdragon 888 | 1 | Jul 04, 2023 | |
| Snapdragon 7c gen3 compute | 1 | Jun 06, 2023 | |
| Snapdragon xr2 gen1 platform | 1 | Jun 06, 2023 | |
| Snapdragon ar2 gen1 platform | 1 | Jun 06, 2023 | |
| Snapdragon w5 gen1 wearable platform | 1 | Jun 06, 2023 | |
| Snapdragonwear 4100 platform | 1 | Jun 06, 2023 | |
| Qcs400 | 11 | Jun 06, 2023 | |
| C v2x9150 | 1 | Jun 06, 2023 | |
| Sdm450 | 183 | Jun 06, 2023 | |
| 8917 | 7 | May 02, 2023 |