Product Detail

EXYNOS 850 FIRMWARE

https://semiconductor.samsung.com/processor/mobile-processor/

Vendor :

Samsung

Number of CVE:

69

Average Exploit Prediction Score :

0.30

Public Exploit/PoC Code :

3

CISA Actively Exploited :

0

Last Vulnerability Seen :

Oct. 20, 2025
Vulnerabilities

The following vulnerabilities are recorded EXYNOS 850 FIRMWARE product. You can click on the vulnerability to view more details.

Number Published CVE ID Severity CVSS Score
1 Nov 04, 2024 CVE-2024-45185 MEDIUM
5.1
2 Oct 11, 2024 CVE-2024-45184 MEDIUM
6.2
3 Oct 07, 2024 CVE-2024-44068 HIGH
8.1
4 Sep 10, 2024 CVE-2024-25074 MEDIUM
5.9
5 Sep 10, 2024 CVE-2024-25073 MEDIUM
5.9
6 Sep 09, 2024 CVE-2024-27365 MEDIUM
5.5
7 Sep 09, 2024 CVE-2024-27387 HIGH
7.8
8 Sep 09, 2024 CVE-2024-27383 HIGH
7.8
9 Sep 09, 2024 CVE-2024-27368 MEDIUM
5.5
10 Sep 09, 2024 CVE-2024-27367 MEDIUM
5.5
11 Sep 09, 2024 CVE-2024-27366 MEDIUM
5.5
12 Sep 09, 2024 CVE-2024-27364 MEDIUM
5.5
13 Jul 09, 2024 CVE-2024-29153 HIGH
8.1
14 Jul 09, 2024 CVE-2024-28068 MEDIUM
5.3
15 Jul 09, 2024 CVE-2023-50806 HIGH
8.4
16 Jul 09, 2024 CVE-2023-50805 HIGH
8.1
17 Jul 09, 2024 CVE-2024-27360 HIGH
7.5
18 Jun 13, 2024 CVE-2024-32504 HIGH
8.4
19 Jun 07, 2024 CVE-2024-32502 HIGH
8.4
20 Jun 07, 2024 CVE-2024-32503 HIGH
8.4
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