Product Detail
EXYNOS 850 FIRMWARE
https://semiconductor.samsung.com/processor/mobile-processor/
Public Exploit/PoC Code :
3
CISA Actively Exploited :
0
Last Vulnerability Seen :
Feb. 03, 2026
Vulnerabilities
The following vulnerabilities are recorded
EXYNOS 850 FIRMWARE product. You can click on the
vulnerability to view more details.
| Number | Published | CVE ID | Severity | CVSS Score | |
|---|---|---|---|---|---|
| 1 | Sep 10, 2024 | CVE-2024-25074 | MEDIUM |
5.9
|
|
| 2 | Sep 10, 2024 | CVE-2024-25073 | MEDIUM |
5.9
|
|
| 3 | Sep 09, 2024 | CVE-2024-27365 | MEDIUM |
5.5
|
|
| 4 | Sep 09, 2024 | CVE-2024-27387 | HIGH |
7.8
|
|
| 5 | Sep 09, 2024 | CVE-2024-27383 | HIGH |
7.8
|
|
| 6 | Sep 09, 2024 | CVE-2024-27368 | MEDIUM |
5.5
|
|
| 7 | Sep 09, 2024 | CVE-2024-27367 | MEDIUM |
5.5
|
|
| 8 | Sep 09, 2024 | CVE-2024-27366 | MEDIUM |
5.5
|
|
| 9 | Sep 09, 2024 | CVE-2024-27364 | MEDIUM |
5.5
|
|
| 10 | Jul 09, 2024 | CVE-2024-29153 | HIGH |
8.1
|
|
| 11 | Jul 09, 2024 | CVE-2024-28068 | MEDIUM |
5.3
|
|
| 12 | Jul 09, 2024 | CVE-2023-50806 | HIGH |
8.4
|
|
| 13 | Jul 09, 2024 | CVE-2023-50805 | HIGH |
8.1
|
|
| 14 | Jul 09, 2024 | CVE-2024-27360 | HIGH |
7.5
|
|
| 15 | Jun 13, 2024 | CVE-2024-32504 | HIGH |
8.4
|
|
| 16 | Jun 07, 2024 | CVE-2024-32502 | HIGH |
8.4
|
|
| 17 | Jun 07, 2024 | CVE-2024-32503 | HIGH |
8.4
|
|
| 18 | Jun 05, 2024 | CVE-2024-27382 | HIGH |
7.1
|
|
| 19 | Jun 05, 2024 | CVE-2024-27381 | MEDIUM |
6.0
|
|
| 20 | Jun 05, 2024 | CVE-2024-27380 | MEDIUM |
6.0
|