Product Detail
EXYNOS 850 FIRMWARE
https://semiconductor.samsung.com/processor/mobile-processor/
Public Exploit/PoC Code :
3
CISA Actively Exploited :
0
Last Vulnerability Seen :
Dec. 03, 2025
Vulnerabilities
The following vulnerabilities are recorded
EXYNOS 850 FIRMWARE product. You can click on the
vulnerability to view more details.
| Number | Published | CVE ID | Severity | CVSS Score | |
|---|---|---|---|---|---|
| 1 | Jun 05, 2024 | CVE-2023-49928 | HIGH |
7.5
|
|
| 2 | Jun 05, 2024 | CVE-2023-49927 | MEDIUM |
5.3
|
|
| 3 | Jun 04, 2024 | CVE-2024-29152 | HIGH |
7.5
|
|
| 4 | Dec 13, 2023 | CVE-2023-43122 | MEDIUM |
4.8
|
|
| 5 | Nov 08, 2023 | CVE-2023-41112 | HIGH |
7.5
|
|
| 6 | Nov 08, 2023 | CVE-2023-41111 | HIGH |
7.5
|
|
| 7 | Sep 08, 2023 | CVE-2023-37377 | HIGH |
7.5
|
|
| 8 | Sep 08, 2023 | CVE-2023-37368 | HIGH |
7.5
|
|
| 9 | Sep 08, 2023 | CVE-2023-37367 | MEDIUM |
5.3
|
|
| 10 | Aug 28, 2023 | CVE-2023-36481 | HIGH |
7.5
|
|
| 11 | Mar 13, 2023 | CVE-2023-26073 | CRITICAL |
9.8
|
|
| 12 | Mar 13, 2023 | CVE-2023-26074 | CRITICAL |
9.8
|
|
| 13 | Mar 13, 2023 | CVE-2023-26072 | CRITICAL |
9.8
|
|
| 14 | Mar 10, 2023 | CVE-2023-26075 | CRITICAL |
9.8
|